Integrated circuits with image sensors and methods for producing the same

ABSTRACT

Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a photodetector, where the photodetector includes an impingement photodetector well and a base photodetector well. A transfer transistor overlies the photodetector, where the transfer transistor includes a transfer gate, a source, and a drain. A source contact is electrically connected to the source, and the source contact is also electrically connected to the photodetector.

TECHNICAL FIELD

The technical field generally relates to integrated circuits with imagesensors and methods of producing the same, and more particularly relatesto integrated circuits with image sensors having reduced surface areas,and methods of producing the same.

BACKGROUND

Integrated circuits with image sensors are utilized in a wide variety oftechnologies. Impinging a photodetector with an electromagneticradiation source, such as light, produces an electrical current in thephotodetector. This electrical current produced in the photodetector canthen be amplified and transmitted, and an array of the photodetectorscan be used to produce an image. This technology often utilizes aplurality of image sensors, where each image sensor serves as a pixel inan image. Each image sensor that forms a pixel has typically included aphotodiode, a transfer gate, and a reset gate. However, the photodiode,the transfer gate, and the reset gate compete for space on an integratedcircuit. Scaling the image sensor to smaller sizes tends to reduce thearea of photodiodes to sizes that result in reduced voltage, increasednoise level, and reduced overall performance.

Image sensors are often utilized to detect electromagnetic radiation inthe visible region of about 380-740 nanometers (nm). Pixel size scalingrisks insufficient full well capacity (FWC) of the photo diode due toreduced capacitance of the photo diode, and consequently sensorperformance degradation. Examples of sensor performance degradationinclude, but are not limited to, a reduced signal to noise ratio,decreased dynamic range, and other performance issues.

Accordingly, it is desirable to provide integrated circuits with imagesensors that allow for reduced overall size as compared to existingimage sensors, and methods of producing the same. In addition, it isdesirable to provide integrated circuits with image sensors havingreduced surface area with sufficient full well capacity of the photodiode for efficient detection of visible light. Furthermore, otherdesirable features and characteristics of the present embodiments willbecome apparent from the subsequent detailed description and theappended claims, taken in conjunction with the accompanying drawings andthis background.

BRIEF SUMMARY

Integrated circuits and methods of producing the same are provided. Inan exemplary embodiment, an integrated circuit includes a photodetector,where the photodetector includes an impingement photodetector well and abase photodetector well. A transfer transistor overlies thephotodetector, where the transfer transistor includes a transfer gate, asource, and a drain. A source contact is electrically connected to thesource, and the source contact is also electrically connected to thephotodetector.

An integrated circuit is provided in another exemplary embodiment. Theintegrated circuit includes a photodetector, where the photodetectorincludes an impingement photodetector well and a base photodetectorwell. A buried insulator overlies the photodetector. A pixel circuitoverlies the buried insulator, where the pixel circuit includes alltransistors that are dedicated to one photodetector. The pixel circuitincludes a single transistor.

A method of producing an integrated circuit is provided in yet anotherembodiment. The method includes forming a photodetector that includes animpingement photodetector well and a base photodetector well. A transfertransistor is formed overlying a buried insulator, where the buriedinsulator overlies the photodetector. The transfer transistor includes atransfer gate, a source and a drain. A source contact is formed, wherethe source contact is electrically connected to the source and also tothe base photodetector well.

BRIEF DESCRIPTION OF THE DRAWINGS

The present embodiments will hereinafter be described in conjunctionwith the following drawing figures, wherein like numerals denote likeelements, and wherein:

FIGS. 1-9 are cross sectional views of embodiments of an integratedcircuit, and methods for producing the same; and

DETAILED DESCRIPTION

The following detailed description is merely exemplary in nature and isnot intended to limit the various embodiments or the application anduses thereof. Furthermore, there is no intention to be bound by anytheory presented in the preceding background or the following detaileddescription. Embodiments of the present disclosure are generallydirected to integrated circuits and methods for fabricating the same.The various tasks and processes described herein may be incorporatedinto a more comprehensive procedure having additional processes orfunctionality not described in detail herein. In particular, variousprocesses in the manufacture of integrated circuits are well-known andso, in the interest of brevity, many conventional processes will only bementioned briefly herein or will be omitted entirely without providingthe well-known process details.

An integrated circuit includes an image sensor, where the image sensorincludes a transfer transistor overlying a buried insulator, and aphotodetector underlying the buried insulator. The photodetectorincludes a P/N junction formed between and by an impingementphotodetector well and a base photodetector well. The transfertransistor includes a source and a drain, and an electrically conductivecontact is electrically connected with the source and also with the basephotodetector well. The size of the photodetector is not limited by thetransfer transistor, because the photodetector and transfer transistorare on opposite sides of the buried insulator, and the electricalconnection between the source and the base photodetector well eliminatesthe need for a reset transistor dedicated to each image sensor.

Reference is made to an exemplary embodiment of an integrated circuitand a method of producing the same as illustrated in FIGS. 1-7.Referring to FIG. 1, an integrated circuit 10 includes a substrate 12,where the substrate 12 may be a silicon on insulator substrate (SOIsubstrate) 12. The SOI substrate 12 includes a handle layer 14, a buriedinsulator 16 overlying the handle layer 14, and an active layer 18overlying the buried insulator 16. As used herein, the term “overlying”means “over” such that an intervening layer may lie between theoverlying component (the active layer 18 in this example) and theunderlying component (the buried insulator 16 in this example,) or “on”such that the overlying component physically contacts the underlyingcomponent. Moreover, the term “overlying” means a vertical line passingthrough the overlying component also passes through the underlyingcomponent, such that at least a portion of the overlying component isdirectly over at least a portion of the underlying component. It isunderstood that the integrated circuit 10 may be moved such that therelative “up” and “down” positions change, and the integrated circuit 10can be operated in any orientation. Spatially relative terms, such as“top”, “bottom”, “over” and “under” are made in the context of theorientation of the cross-sectional FIG. 1. It is to be understood thatspatially relative terms refer to the orientation in the figures, so ifthe integrated circuit 10 were to be oriented in another manner thespatially relative terms would still refer to the orientation depictedin the figures. Thus, the exemplary terms “over” and “under” remain thesame even if the device is twisted, flipped, or otherwise oriented otherthan as depicted in the figures.

As used herein, the term “substrate materials” will be used to encompasssemiconductor materials conventionally used in the semiconductorindustry to make electrical devices. Semiconductor materials includemonocrystalline silicon materials, such as the relatively pure orlightly impurity-doped monocrystalline silicon materials typically usedin the semiconductor industry, as well as polycrystalline siliconmaterials, and silicon admixed with other elements such as germanium,carbon, and the like. Semiconductor material also includes othermaterials such as relatively pure and impurity-doped germanium, galliumarsenide, zinc oxide, glass, and the like. In an exemplary embodiment,the active layer 18 is a monocrystalline silicon material, but othersubstrate materials may be used in alternate embodiments. The buriedinsulator 16 is silicon dioxide in an exemplary embodiment, but sapphireor other insulating materials may also be used. As used herein, an“electrically insulating material” is a material with a resistivity ofabout 1×10⁴ ohm meters or more, an “electrically conductive material” isa material with a resistivity of about 1×10⁴ ohm meters or less, and an“electrically semiconductive material” is a material with a resistivityof from about more than 1×10⁴ ohm meters to less than about 1×10⁴ ohmmeters. The handle layer 14 provides mechanical strength and stabilityto the SOI substrate 12, and is monocrystalline silicon in an exemplaryembodiment. However, a wide variety of other materials that providemechanical strength and stability may be used in alternate embodiments.

An isolation trench 20 is formed in the substrate 12 for an isolationstructure. The isolation trench 20 can be formed by any suitabletechnique. In an exemplary embodiment, an isolation photoresist layer 22is deposited overlying the substrate 12, and patterned for the positionsof the desired isolation structures. The isolation photoresist layer 22(and other photoresist layers described below) may be deposited by spincoating, and patterned by exposure to light or other electromagneticradiation through a mask with transparent sections and opaque sections.The light causes a chemical change in the photoresist such that eitherthe exposed portion or the non-exposed portion can be selectivelyremoved. The desired locations may be removed with an organic solvent,and the isolation photoresist layer 22 remains overlying the other areasof the substrate 12. The isolation photoresist layer 22 (and otherphotoresist layers described below) may optionally include a top and/orbottom anti-reflective coating and/or a hard mask (not illustrated).Many anti-reflective coatings are available, including inorganic andorganic compounds, such as titanium nitride or organosiloxanes. Titaniumnitride may be deposited by chemical vapor deposition usingtetramethylamidotitanium and nitrogen trifluoride, and organosiloxanesmay be deposited by spin coating. Anti-reflective coatings may improvethe accuracy and critical dimensions during photoresist patterning.Silicon nitride may be used as a hard mask, where silicon nitride can beformed by low pressure chemical vapor deposition using ammonia anddichlorosilane. The isolation trench 20 is then anisotropically etchedthrough the isolation photoresist layer 22 and into the substrate 12,such as by reactive ion etch with silicon hexafluoride. In an exemplaryembodiment, the isolation trench 20 passes through the active layer 18and the buried insulator 16, and extends for some distance into thehandle layer 14. The isolation trench 20 extends into the substrate 12to a desired depth that is sufficient to electrically isolate adjacentsections of the substrate 12 for different purposes. The isolationphotoresist layer 22 may then be removed, such as with an oxygencontaining plasma.

A pinning region 24 may optionally be formed along a side wall of theisolation trench 20. The pinning region 24 may be formed with a tiltimplant, where the substrate 12 is tilted relative to a source ofimplantation ions such that the implantation ions impact the handlelayer 14 of the substrate 12 along the side wall of the isolation trench20. In an exemplary embodiment, the optional pinning region 24 is formedby implanting “P” type conductivity determining impurities (i.e.dopants) as ions into the side wall of the handle layer 14. “P” typeconductivity determining impurities typically include boron, aluminum,gallium, and indium, but other materials could also be used. “N” typeconductivity determining impurities typically include phosphorous,arsenic, and/or antimony, but other materials could also be used. Ionimplantation may involve ionizing the conductivity determining impurityand propelling the ions into the substrate 12 under the influence of anelectrical field. The pinning region 24 may then annealed to repaircrystal damage from the ion implantation process, to electricallyactivate the conductivity determining impurities, and to redistributethe conductivity determining impurities within the semiconductormaterial. The annealing process can use widely varying temperatures,such as temperatures ranging from about 500 degrees centigrade (° C.) toabout 1,200° C. The annealing process may be performed immediately afterion implantation, or at a later time that is convenient for themanufacturing process. In some embodiments a single anneal is utilizedfor multiple different implants, so the anneal for the pinning region 24is often also the anneal for other areas or components that have beenimplanted with conductivity determining impurities.

Referring to an exemplary embodiment illustrated in FIG. 2, withcontinuing reference to FIG. 1, isolation structures 26 are formedwithin the substrate 12. The isolation trench 20 may be filled with anelectrically insulating material, such as silicon dioxide, which may bedeposited by chemical vapor deposition using silane and oxygen.

Overburden may then be removed, such as by chemical mechanicalplanarization to produce the isolation structure 26. Electricallyinsulating materials other than silicon dioxide may be utilized inalternate embodiments, and alternate deposition techniques may also beutilized. The optional pinning region 24 remains within the handle layer14 adjacent to the isolation structure 26.

An impingement photodetector well 30 and a base photodetector well 32are formed in the handle layer 14, as illustrated in an exemplaryembodiment in FIG. 3. The impingement photodetector well 30 and basephotodetector well 32 may be formed by ion implantation, as describedabove, where the ion implantation energy is adjusted to implant the ionsat the desired depth within the substrate 12. The ions may be implantedthrough the active layer 18 and the buried insulator 16 in an exemplaryembodiment, but it is also possible to implant the ions through a bottomsurface of the handle layer 14 such that the ions do not pass throughthe active layer 18 and buried insulator 16 en route to the handle layer14. The base photodetector well 32 overlies the impingementphotodetector well 30, and the base photodetector well 32 may beadjacent to one or more of the isolation structures 26. In an exemplaryembodiment, the base photodetector well 32 about fills the space betweentwo adjacent isolation structures 26, which maximizes the size of thebase photodetector well 32 for a pixel that is defined between adjacentisolation structures 26. The impingement photodetector well 30 may havea surface area that is at least as large as a surface area of the basephotodetector well 32, where the referenced surface areas of the baseand impingement photodetector wells 32, 30 are parallel to each otherand to a bottom plane of the buried insulator 16. The pinning region 24may be positioned and defined between the isolation structure 26 and theadjacent base photodetector well 32.

The impingement photodetector well 30 and the base photodetector well 32primarily include different types of conductivity determiningimpurities, so the interface produces a P/N junction. The impingementphotodetector well 30 and the base photodetector well 32, which includesthe P/N junction therebetween, form a photodetector 28. As such, theoverall area of the photodetector 28 may be about the area definedbetween isolation structures 26, where the isolation structures 26 mayabout determine the surface area of the base and impingementphotodetector wells 32, 30. The photodetector 28 may produce an electronflow when electromagnetic radiation such as light impinges on theimpingement photodetector well 30. In an exemplary embodiment, theimpingement photodetector well 30 primarily includes “P” typeconductivity determining impurities, and the base photodetector well 32primarily includes “N” type conductivity determining impurities, but thereverse is possible in alternate embodiments. A component “primarily”includes one type of conductivity determining impurity if that componentincludes more of the primary type of conductivity determining impuritythan the opposite. The pinning region 24 primarily includes the sametype of conductivity determining impurity as the impingementphotodetector well 30. In an exemplary embodiment, the impingement andbase photodetector wells 30, 32 have a conductivity determining impurityconcentration of from about 10¹⁵ to about 10¹⁷ atoms per cubiccentimeter (cm³), but other concentrations are also possible. Thepinning region 24 may have a comparable or higher conductivitydetermining impurity concentration than the impingement photodetectorwell 30 in some embodiments.

FIG. 4 illustrates an embodiment where a portion of the active layer 18and the underlying buried insulator 16 are removed. The removed portionsof the active layer 18 and the buried insulator 16 form a source contactgap 33 that may be adjacent to an isolation structure 26 in someembodiments. As such, the source contact gap 33 is free of the activelayer 18 and also free of the buried insulator 16. The portions of theactive layer 18 and the buried insulator 16 are removed with anisotropicetches in an exemplary embodiment, and the portions of the active layer18 and the buried insulator 16 that remain may be lithographicallyprotected from the etchants. In one exemplary embodiment, the activelayer 18 is removed with a reactive ion etch using chlorine and hydrogenbromide, and the buried insulator 16 is removed with a reactive ion etchusing carbon tetrafluoride, but many other etchants or etchingtechniques may be utilized in alternate embodiments. The source contactgap 33 exposes a portion of the base photodetector well 32.

Reference is made to an exemplary embodiment in FIG. 5. A transfertransistor 34 is formed overlying the buried insulator 16. The transfertransistor 34 includes a source 36, a drain 38, a transfer gate 40, atransistor insulator 42, and a channel 43 that is a portion of theactive layer 18 directly underlying the transfer gate 40 and between thesource 36 and drain 38. The transfer transistor 34 overlies thephotodetector 28 and the buried insulator 16, and the transfertransistor 34 and the photodetector 28 are on opposite sides of theburied insulator 16 such that the buried insulator 16 is between thephotodetector 28 and the transfer transistor 34. The transfer transistor34 may be formed using standard techniques, and may include optionalspacers 44, optional extensions on the source 36 and drain 38 (notillustrated), and other components in various embodiments. The transfertransistor 34 may be formed by depositing an insulating layer followedby a gate layer (not individually illustrated), and thenlithographically removing portions of the insulating and gate layer toform the transistor insulator 42 and the transfer gate 40. The sourceand drain extensions (not illustrated) may be implanted, and the spacers44 may be formed by blanket depositing a spacer layer (not individuallyillustrated) and then anisotropically removing the bulk of the spacerlayer to leave the spacers 44 adjacent to the transfer gate 40. Thesource 36 and drain 38 may then be formed by implanting conductivitydetermining impurities into the active layer 18.

In an exemplary embodiment, the source 36 and the drain 38 primarilyinclude the same type of conductivity determining impurity as the basephotodetector well 32. So, for example, if the base photodetector well32 primarily includes “N” type conductivity determining impurities, thesource 36 and drain 38 also primarily include “N” type conductivitydetermining impurities. Many variations of the transfer transistormanufacturing process are possible. The transistor insulator 42 and thespacers 44 are electrical insulators, and the transfer gate 40, thesource 36, and the drain 38 are electrical conductors in an exemplaryembodiment. The source 36 of the transfer transistor 34 may extend to apoint directly adjacent to the source contact gap 33, such that there isno active layer 18 independent of the source 36 that is positionedbetween the source 36 and the source contact gap 33. The source contactgap 33 may be defined between the source 36 and one of the isolationstructures 26 in some embodiments. In some embodiments, the source 36extends to the edge of the active layer 18 adjacent the source contactgap 33, so the source 36 may terminate at the location where the activelayer 18 and the buried insulator 16 were removed to form the sourcecontact gap 33, as previously illustrated in FIG. 4.

An interlayer dielectric layer 50 is formed overlying the substrate 12and the transfer transistor 34, as well as within the source contact gap33, as illustrated in an exemplary embodiment in FIG. 6 with continuingreference to FIG. 5. The source contact gap 33 is filled with materialfrom the interlayer dielectric layer 50 or other materials, but the areais still referred to as the source contact gap 33 in this disclosure tobetter explain the integrated circuit 10. The interlayer dielectriclayer 50 may include a wide variety of electrically insulating materialsin various embodiments. For example, un-doped silicate glass (USG),silicon nitride, silicon oxynitride, silicon dioxide, low K dielectricmaterials, or combinations thereof may be used. In an exemplaryembodiment, silicon dioxide is deposited by chemical vapor depositionusing silane and oxygen, but other techniques and/or materials areutilized in alternate embodiments. A plurality of vias 52 may then beformed in the interlayer dielectric layer 50 using a via photoresistlayer 54. In an exemplary embodiment, different vias 52 extend to a topsurface of (i) the transfer gate 40, (ii) the drain 38, and (iii) thesource 36. The via 52 that extends to the source 36 also extends to atop surface of the base photodetector well 32 through the source contactgap 33. The vias 52 may be produced with a reactive ion etch usingcarbon tetrafluoride in an exemplary embodiment, but many differentetchants or etch techniques may be utilized in alternate embodiments.The via photoresist layer 54 is removed after use.

A plurality of contacts are formed within the vias 52, as illustrated inan exemplary embodiment in FIG. 7 with continuing reference to FIG. 6.The contacts include a source contact 60, a transfer gate contact 62,and a drain contact 64, where the contacts are electrically conductive.In an exemplary embodiment, the contacts include an adhesion layer, abarrier layer, and a plug (not shown), which are sequentially deposited.For example, an adhesion layer of titanium may be formed by low pressurechemical vapor deposition of titanium pentachloride, a barrier layer oftitanium nitride may be formed by chemical vapor deposition of titaniumtetrabromide and ammonia, and a plug of tungsten may be formed bychemical vapor deposition of tungsten hexafluoride and hydrogen. Othertypes of contacts are also possible, such as copper or other conductivematerials. Overburden may be removed after the contacts are formed, suchas with chemical mechanical planarization.

The source contact 60 is electrically connected with the source 36 andwith the base photodetector well 32. The term “electrically connected,”as used herein, means electrical current is capable of flowing from onecomponent to another, where the electrical current may or may not flowthrough an electrically conductive or semiconductive interveningcomponent. The term “direct electrical contact,” as used herein, meansdirect physical contact between components that are electricallyconductive or semiconductors, but not electrical insulators. In anexemplary embodiment, the source contact 60 is in direct electricalcontact with the source 36 and also with the base photodetector well 32,where a silicide layer formed on the surface of the source 36 and/orbase photodetector well 32 is considered a portion of the source 36and/or base photodetector well 32 for direct electrical contact. Thesource contact 60 extends through the source contact gap 33 toelectrically connect with the base photodetector well 32 of thephotodetector 28. As such, in an exemplary embodiment the source contact60 is in direct contact with a side surface of the buried insulator 16,and also in direct contact with a side surface of the source 36.

The base photodetector well 32 and the impingement photodetector well 30form a P/N junction for the photodetector 28, as described above. Animage sensor 68 includes the photodetector 28 and the transfertransistor 34. The impingement photodetector well 30 may be exposed to asource of light, such that light or other electromagnetic radiationimpinges on the impingement photodetector well 30 and produces anelectron flow within the photodetector 28. The photodetector 28 may bereset using a bias introduced to the handle layer 14, so a plurality ofphotodetectors 28 from different image sensors 68 may be reset at thesame time. The image sensor 68 includes a pixel circuit 70, where thepixel circuit 70 includes all the transistors that are dedicated to onephotodetector 28 of one image sensor 68. A transistor is “dedicated” toone photodetector 28 if that transistor is configured so that it onlyfunctions in conjunction with the one photodetector 28. Because thephotodetector 28 may be reset using a bias introduced to the handlelayer 14, there is no reset transistor within the pixel circuit 70 thatis dedicated to one image sensor 68. As such, that the pixel circuit 70is free of a reset transistor. In an exemplary embodiment, the pixelcircuit 70 only includes one transistor, and that is the transfertransistor 34.

The transfer transistor 34 of the image sensor 68 is on the oppositeside of the buried insulator 16 from the photodetector 28, so there isno competition for surface area, or footprint area, between the transfertransistor 34 and the photodetector 28. As a result, the photodetector28 may have an exposed bottom surface of the impingement photodetectorwell 30 that extends for about the full area defined by the isolationstructures 26, as mentioned above. Furthermore, the handle layer 14 istypically thicker than the active layer 18, so the photodetector 28 isthicker than if it were formed in the active layer 18. The surface areaand capacitance of an integrated photodetector 28 underlying the buriedinsulator 16 is not limited by an overlying transistor, because thetransfer transistor 34 and the photodetector 28 are on opposite sides ofthe buried insulator 16. Consequently, the full well capacity and sensorperformance are not reduced by a reduction of the surface area of thephotodetector 28 that would be sacrificed if the transfer transistor 34were to overlie a portion of the surface area of the photodetector 28that receives light or other electromagnetic radiation.

Many different embodiments of the image sensor are possible. In oneexemplary embodiment, the image sensor 68A is formed with a deepisolation structure 27A and a shallow isolation structure 29A, asillustrated in an exemplary embodiment in FIG. 8. FIG. 8 includes adashed line distinguishing the deep isolation structure 27A from theshallow isolation structure, but the deep and shallow isolationstructures 27A, 29A may be one continuous material in an exemplaryembodiment. The source contact gap 33A is positioned between the shallowisolation structure 29A and the source 36A of the transfer transistor34A, and the shallow isolation structure 29A overlies a portion of thebase photodetector well 32A and the impingement photodetector well 30A.The source contact gap 33A is also positioned between the shallowisolation structure 29A and the buried insulator 16A. The source contact60A may extend to the base photodetector well 32A through the sourcecontact gap 33A. In this embodiment, the source contact 60A directlycontacts the shallow isolation structure 29A, but in alternateembodiments (not illustrated) the source contact may directly contact anisolation structure that does not include a shallow isolation structure.In the illustrated embodiment in FIG. 8, the optional pinning region isnot included.

Another possible embodiment is illustrated in FIG. 9. In FIG. 9, thesource 36B and drain 38B are increased in volume, such as with epitaxialgrowth. The source contact 60B extends through the source contact gap33B to the base photodetector well 32B. In this embodiment, the sourcecontact gap 33B is positioned between the source 36B and a portion ofthe active layer 18B that was not removed during formation of the sourcecontact gap 33B, where that remaining portion of the active layer 18B isadjacent to an isolation structure 26B. In all embodiments, the sourcecontact 60B is electrically connected with both the source 36B and thebase photodetector well 32B.

While at least one exemplary embodiment has been presented in theforegoing detailed description, it should be appreciated that a vastnumber of variations exist. It should also be appreciated that theexemplary embodiments are only examples, and are not intended to limitthe scope, applicability, or configuration of the application in anyway. Rather, the foregoing detailed description will provide thoseskilled in the art with a convenient road map for implementing one ormore embodiments, it being understood that various changes may be madein the function and arrangement of elements described in an exemplaryembodiment without departing from the scope, as set forth in theappended claims.

What is claimed is:
 1. An integrated circuit comprising: a photodetectorcomprising an impingement photodetector well and a base photodetectorwell; a transfer transistor overlying the photodetector, wherein thetransfer transistor comprises a transfer gate, a source, and a drain;and a source contact electrically connected to the source, wherein thesource contact is also electrically connected to the photodetector. 2.The integrated circuit of claim 1 wherein the base photodetector wellprimarily comprises “N” type conductivity determining impurities, andwherein the impingement photodetector well primarily comprises “P” typeconductivity determining impurities.
 3. The integrated circuit of claim1 further comprising two adjacent isolation structures, wherein the basephotodetector well overlies the impingement photodetector well, andwherein the base photodetector well about fills a space between the twoadjacent isolation structures.
 4. The integrated circuit of claim 1wherein the source contact is in direct electrical contact with thesource, and wherein the source contact is in direct electrical contactwith the photodetector.
 5. The integrated circuit of claim 1 furthercomprising an isolation structure, wherein the base photodetector wellis positioned adjacent to the isolation structure.
 6. The integratedcircuit of claim 1 wherein the source and the base photodetector wellprimarily include the same type of conductivity determining impurity. 7.The integrated circuit of claim 1 wherein the source contact is indirect electrical contact with the base photodetector well.
 8. Theintegrated circuit of claim 1 further comprising a buried insulatorpositioned between the transfer transistor and the photodetector.
 9. Theintegrated circuit of claim 1 further comprising: an isolation structureadjacent to the base photodetector well; and a source contact gapdefined between the transfer transistor and the isolation structure. 10.The integrated circuit of claim 1 further comprising: a substrate,wherein the substrate comprises an active layer, a buried insulator, anda handle layer; and a source contact gap defined between the transfertransistor and a portion of the active layer, wherein the source contactgap is free of the buried insulator.
 11. The integrated circuit of claim5 further comprising a pinning region defined between the isolationstructure and the photodetector.
 12. The integrated circuit of claim 8wherein the source contact is in direct contact with a side surface ofthe buried insulator, and wherein the source contact is in directcontact with a side surface of the source.
 13. The integrated circuit ofclaim 9 wherein the source contact is positioned within the sourcecontact gap.
 14. The integrated circuit of claim 9 wherein the isolationstructure comprises a deep isolation structure and a shallow isolationstructure, wherein the shallow isolation structure overlies a portion ofthe base photodetector well.
 15. An integrated circuit comprising: aphotodetector comprising an impingement photodetector well and a basephotodetector well; a buried insulator overlying the photodetector; apixel circuit overlying the buried insulator, wherein the pixel circuitcomprises a single transistor, the single transistor is a transfertransistor, the transfer transistor comprises a source, a transfer gate,and a drain, wherein the integrated circuit further comprises a sourcecontact electrically connected to the source, and wherein the sourcecontact is also electrically connected to the photodetector.
 16. Theintegrated circuit of claim 15 wherein the source contact is in directcontact with the base photodetector well, and wherein the source contactis in direct contact with the source.
 17. The integrated circuit ofclaim 15 wherein the source comprises conductivity determiningimpurities, the base photodetector well comprises conductivitydetermining impurities, and the source and the base photodetector wellprimarily include the same type of conductivity determining impurities.18. The integrated circuit of claim 15 further comprising a plurality ofisolation structures, wherein the base photodetector well overlies theimpingement photodetector well, and wherein the base photodetector wellis positioned between two of the plurality of isolation structures. 19.A method of producing an integrated circuit comprising: forming aphotodetector comprising an impingement photodetector well and a basephotodetector well; forming a transfer transistor overlying a buriedinsulator, wherein the buried insulator overlies the photodetector, andwherein the transfer transistor comprises a transfer gate, a source, anda drain; and forming a source contact electrically connected to thesource and to the base photodetector well.